Micron is expanding a factory in Taiwan that will not produce new chips until at least the end of 2027.
Satlantis says the value added by its Elcano system is almost entirely European, although it still buys some U.S.-made FPGA and NVIDIA chips.
High-Bandwidth Memory chips stack multiple layers of modified memory dies vertically via through-silicon vias.
Iridium Communications plans to offer alternative PNT capabilities anywhere on Earth using ultra-compact PNT chips.
One restriction removed after the visit reportedly affected Nvidia’s AI chips.
Tom Stroup said the satellite industry’s supply chain is under strain from competition for radiation-resistant chips and other specialized components.
Elon Musk confirmed in mid-March 2026 that SpaceX is ordering Nvidia chips at scale.
MDA Space received the first shipments of space-grade chips for integration into MDA Aurora.
The chips on Artemis II are embedded in HERA, or Hybrid Electronic Radiation Assessor.
Space Tango developed the payload that carries the Avatar chips on Artemis II.
ADVACAM has six chips flying on Artemis II to measure how cosmic radiation affects astronauts and Orion electronics.
Renesas Electronics Corporation’s Intersil brand chips help regulate and distribute power, maintain signal integrity, and support onboard computing in Orion and the Space Launch System.
Starcloud is among Nvidia’s partners for its space chips.
Telesat pushed Lightspeed’s full global commercial service to the first quarter of 2028 because of readiness delays with custom SatixFy ASIC chips powering the onboard processors.
Nvidia H100 AI chips are being tested in orbit.
Hubble Network bridged a 650-kilometer gap between terrestrial Bluetooth Low Energy chips and its Low Earth Orbit satellite constellation using a proprietary protocol and a lightweight Software Development Kit.
Hubble Network demonstrated the first-ever direct-to-satellite connection using standard off-the-shelf Bluetooth Low Energy chips on March 9, 2026 at Embedded World 2026 in Nuremberg, Germany.
Rocket Lab received a $23.9 million award under the U.S. CHIPS and Science Act in October 2025 to expand semiconductor production capabilities in Albuquerque, New Mexico.
Products from the glow discharge plasma condensed onto silicon chips inside the tubes as a thin layer of carbon-rich dust.
The University of Sydney node of Microscopy Australia provided assistance that enabled detailed examination of the laboratory dust particles on the silicon chips.