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Chips

retired
Science ExplorationLEOCOSPAR 2003-002BLaunched 1/13/2003
Admin Edit
Mission & Launch
Launch Mission
ICESAT/Chipsat
Launch Vehicle
Delta 7320-10
Launch Date
1/13/2003
Last Contact
4/11/2008
Orbit & Mass
Orbit Class
LEO
Altitude
585.5 km
Inclination
94.01 deg
Dry Mass
60 kg
Total Mass
60 kg
Payload Classification
Mission Type
Science Exploration
Payload Category
AST
Payload Class
C
Organizations
Operator
NASA Goddard Space Flight Center
Manufacturer
SpaceDev
Registry
COSPAR ID
2003-002B
UN Registration
ST/SG/SER.E/428
Track
Mentions
115
All verified mentions of this spacecraft in source documents.
0.0-5.0
Actions

Neither the SAT Streamlining Act nor the Secure Space Act of 2025 includes provisions requiring domestically sourced components, domestic manufacturing capacity investment, or dual-sourcing mandates for critical satellite materials and chips.

LegalGeneralValue 3.0Mar 3, 2026The Legislation Gap
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Google’s Project Suncatcher plans to fly two prototype satellites equipped with Google-developed TPU AI chips in 2027 in partnership with Planet.

PlanRelationshipsCapabilityValue 4.5Feb 27, 2026China's Space Enterprises Quietly Lead in-Space AI Compute Capabilities

Sener coordinates SGAN-Next, an international initiative to develop a new generation of European-made electronic chips based on gallium nitride technology (GH-10).

CapabilityPlanValue 3.8Feb 26, 2026Sener lidera SGAN-Next, la nueva generación de chips electrónicos europeos para satélites

SGAN-Next aims to create chips that are more efficient and compact to strengthen technological autonomy and the supply network of the European space industry.

GeneralCapabilityValue 2.0Feb 26, 2026Sener lidera SGAN-Next, la nueva generación de chips electrónicos europeos para satélites

SGAN-Next focuses on producing chips capable of operating at very high frequencies in the Q-V band to improve antennas and communication systems for satellites in low Earth orbit (LEO) and geostationary orbit (GEO).

CapabilityGeneralValue 4.0Feb 26, 2026Sener lidera SGAN-Next, la nueva generación de chips electrónicos europeos para satélites

By 2028, SpaceX expects the Direct-to-Cell network to support seamless broadband connectivity for standard mobile devices without external hardware or specialized chips.

PlanCapabilityValue 4.0Feb 25, 2026SpaceX Unveils 150Mbps Performance Target for Upgraded Direct-to-Cell Starlink

Google is working with Planet Labs on a space data center project aiming to launch satellites in 2027 carrying Google’s specialized computer chips into orbit.

RelationshipsPlanCapabilityValue 4.6Feb 20, 2026Orbital Data, Niche Markets Give Space Solar a New Shimmer

The neuron concept is compatible with established photonic integration processes, enabling integration alongside lasers, detectors, and control electronics on practical chips.

CapabilityGeneralValue 3.0Feb 17, 2026Photonic neurons push ultra-fast trading beyond electronic limits

Sidus Space is flying onboard computing hardware that evolved from Google Tensor chips to NVIDIA Jetson NX and is preparing to launch systems with the NVIDIA AGX.

CapabilityPlanValue 4.0Feb 11, 2026The End of the Passive Satellite

In the POSTECH all-optical architecture, diffraction and interference serve as the computational engine, enabling information processing and transformation without electronic chips or external power beyond the light source.

CapabilityValue 3.0Feb 4, 2026Stacked metasurfaces use light and spacing to lock holographic data

Congress last passed a NASA authorization in 2022 when a pared-down version was folded into the CHIPS and Science Act.

LegalValue 2.0Feb 3, 2026Congress is Considering a NASA Authorization Bill—Again

Approximately 600 samples will be collected, including rock chips, channels, and grab samples during the Phase I program.

PlanGeneralValue 3.2Jan 23, 2026Orestone Mining Initiates Phase I Exploration at Francisca Gold Project in Argentina

Hubble Network is collaborating with Texas Instruments to integrate its network into TI Bluetooth chips.

RelationshipsCapabilityValue 4.0Jan 8, 2026Latest News

The research team carried out experiments on superconducting quantum processors using devices operated in the University of Queensland laboratory and chips accessed through IBM's cloud-based quantum computing services.

CapabilityGeneralValue 3.1Jan 2, 2026Australian team maps quantum error memory over time

Space Forge is developing larger platforms intended to produce sufficient material for 10,000 chips per mission.

CapabilityGrowthValue 4.0Dec 31, 2025Space Forge Ignites Orbital Furnace, Hits 1,000°C Milestone on ForgeStar-1

Funds raised through the IPO are expected to go towards developing space-based data centers and purchasing necessary chips.

GrowthFinancialCapabilityValue 3.2Dec 16, 2025Musk signals plan to launch IPO for SpaceX

The constellation will use onboard solar arrays to run specialized chips and process user queries in orbit.

CapabilityValue 3.0Dec 9, 2025Space debris looms over Google's ambitious orbital AI data center plan

On-board computing in space is challenging due to the need for chips to be hardened against radiation.

GeneralCapabilityValue 1.2Nov 24, 2025Latest News

Vorago Technologies' new chips are significantly less expensive than traditional space-grade components.

FinancialCapabilityGeneralValue 2.2Nov 19, 2025Radiation-Tolerant Chips for Satellite Constellations Introduced

Türkiye's 2026 Presidential Annual Program includes a comprehensive R&D roadmap prioritizing the space sector alongside chips, AI, and green technologies.

PlanValue 2.0Nov 10, 2025Middle East Space Roundup: 3 to 9 November 2025