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The Leixlip expansion will bring Intel 4 process technology to Europe and expand Intel’s foundry services.
Intel plans to invest an initial 17,000,000,000 EUR into a leading-edge semiconductor fab mega-site in Germany.
Intel plans to create 3,000 permanent high-tech jobs at the Magdeburg site.
Intel’s total planned spending on the cited manufacturing investments exceeds 33,000,000,000 EUR.
Intel plans to establish a European R&D hub around Plateau de Saclay, France that will create 1,000 new high-tech jobs at Intel.
Intel and the Barcelona Supercomputing Center are developing zettascale architecture and plan to establish joint labs in Barcelona.
Intel and Italy have entered negotiations for a state-of-the-art back-end manufacturing facility with a potential investment of up to 4,500,000,000 EUR.
Intel plans to develop two semiconductor fabs in Magdeburg, Germany as part of the initial phase.
Intel spent more than 10,000,000,000 EUR with European suppliers in the past two years and expects that spend to nearly double by 2026.
Benteler EV Systems, Beep Inc., and Mobileye, an Intel Company, formed a strategic collaboration to develop and deploy automotive-grade, fully electric, autonomous movers in public and private communities across North America.
The Express-TL module incorporates Intel Time Coordinated Computing (TCC) combined with a Time-Sensitive Networking (TSN) Ethernet controller to support Industry 4.0 factory robustness and reliability.
FlyTech’s customers include Intel, Motorola, Mekorot, Israel Electric Corp., NTA Metropolitan Mass Transit System, Israel Land Authority, Israel Railways, Tel Aviv — Jaffa Municipality, Ministry of Internal Security, Israel Nature & Parks Authority, Ministry of Agriculture, and the Ministry of Defense.
The DLAP x86 series features a heterogeneous architecture that includes Intel® processors and NVIDIA Turing™ GPU architecture.
Luminar won a contract to supply lidar sensors to Mobileye, an Intel subsidiary.
Intel’s Myriad 2 Vision Processing Unit provides onboard artificial intelligence for the PhiSat-1 system built by Ubotica Technologies and paired with a hyperspectral-thermal camera from cosine measurement systems.
PhiSat-1 contains a hyperspectral-thermal camera and an Intel Movidius Myriad 2 Vision Processing Unit for onboard AI processing.
PhiSat-1 contains a hyperspectral-thermal camera and onboard AI processing powered by an Intel Movidius Myriad 2 Vision Processing Unit (VPU).
The Intel Movidius Myriad 2 VPU on PhiSat-1 is being used to reduce the amount of data that must be downlinked from high-fidelity cameras.
Intel provided background support for the Myriad device to enable PhiSat-1’s AI using CVAI Technology.
ESA and Ubotica are developing PhiSat-2, which will carry another Intel Movidius Myriad 2 VPU into orbit.